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ASE Technology Holding Co., Ltd. (ASX) Stock Price, News & Analysis

ASE Technology Holding Co., Ltd. (ASX) Stock Price, News & Analysis

Currency in USD Disclaimer

$10.16

$0.44

(4.48%)

Day's range
$9.94
Day's range
$10.17
50-day range
$8.89
Day's range
$10.9
  • Country: TW
  • ISIN: US00215W1009
52 wk range
$7.83
Day's range
$12.86


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Analyst Ratings

Key Stats

Key stats represent essential financial metrics and indicators used to evaluate a company's performance and potential investment opportunities.

Stock Score/grades

The Stock Score/Grades evaluate bankruptcy risk and assess the financial strength and fundamental health of a company

  • Altman Z Score 1.34
  • Piotroski Score 5.00
  • Grade Buy
  • Symbol (ASX)
  • Company ASE Technology Holding Co., Ltd.
  • Price $10.16
  • Changes Percentage (4.48%)
  • Change $0.44
  • Day Low $9.94
  • Day High $10.17
  • Year High $12.86

ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.

  • Last Earnings 06/04/2024
  • Ex-Dividend for 5/16 Dividend 07/02/2024
  • Dividend Payable 08/05/2024
  • Today N/A
  • Next Earnings (Estimated) 01/31/2025
  • Fiscal Year End N/A

  • Average Stock Price Target $0.00
  • High Stock Price Target $0.00
  • Low Stock Price Target $0.00
  • Potential Upside/Downside N/A
  • Consensus Rating Neutral
  • Rating Score (0-4) N/A
  • Research Coverage N/A

  • EPS (Most Recent Fiscal Year) $0.50
  • Trailing P/E Ratio 21.48
  • Forward P/E Ratio 21.48
  • P/E Growth 21.48
  • Net Income $31.73 B

Income Statement

Quarterly

Annual

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